In support of education to elevate the talent level of the packaging and processing workforce, PMMI U is sponsoring the pre-conference OMAC PackML Workshop on May 21, held just before the Automation Conference & Expo (22-23 May, Chicago).
“In addition to offering our own workshops, PMMI U supports innovation across the packaging and processing industries,” says Stephan Girard, director, workforce development, PMMI, The Association for Packaging and Processing Technologies. “Sponsoring a workshop like PackML underscores our commitment to keeping our workforce on the cutting edge.”
At this full-day workshop, the Organization for Machine Automation and Control (OMAC) will bring technology experts from B&R Automation, Beckhoff and Siemens together to present PackML coding and programming training. The workshop will cover the history, development and benefits of PackML, applying the PackML State Model and programming with a PackML library. Sessions include hands-on PackML programming in an intimate classroom setting for individualised attention.
In addition to sponsoring the PackML Workshop, PMMI U offers industry training to advance the packaging and processing workforce year-round in convenient locations around the country. For a full list of 2018 workshops, visit pmmi.org/on-the-road.
Established in 1994, OMAC is the organization for automation and manufacturing professionals dedicated to supporting the machine automation and operation needs of manufacturing. OMAC helps manufacturers find new and innovative ways to be successful in their production operations, while maintaining their competitive advantage. Learn more at omac.org.
The Automation Conference & Expo is the leading peer-to-peer educational and networking event for industrial automation professionals. Designed for individuals in the processing, discrete manufacturing and packaging industries, program content is directed by Automation World magazine, with support from Packaging World.
For more information and to register, visit theautomationconference.com.
