Henkel Supra 100 Cool sets new low for application temperature

16 July 2013


Adhesives specialist Henkel claims its new Technomelt Supra 100 Cool hotmelt adhesive establishes a new record in the packaging industry for the lowest application temperature.

“In addition to its low application temperature of 100°C and its high adhesive strength, Technomelt Supra 100 Cool is also characterised by its wide-ranging suitability in case sealing, carton closing and tray erection,” the Germany-based company says.

Production trials carried out by consumer goods manufacturers throughout Europe are said to demonstrate that the low application temperature of Technomelt Supra 100 Cool reduces the energy requirement compared to conventional hotmelts by “up to 50 percent”, delivering higher efficiency in packaging production while also promoting sustainability in customer operations.

Technomelt Supra 100 Cool also offers good heat resistance and cold flexibility, enabling its use for both warm-filling and deep-freeze applications, while the low application temperature also means faster applicator start-up.

“With this new generation of low-temperature packaging adhesives, Henkel combines innovation with sustainability, further underlining its commitment to progress in support of the packaging sector and the consumer goods industry,” Henkel says.



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