BOBST at ProPak Vietnam 2015

10 February 2015


10 Feb 2015

BOBST at ProPak Vietnam 2015

BOBST will be present at ProPak Vietnam from 31st March - 2nd April 2015 where the latest technologies for the printing and converting industries will be presented.

For flexo printing the main focus will be on the BOBST F&K 20SIX which features print widths up to 1'650 mm, repeats up to 1'200 mm, and speeds up to 600 m/min. Designed to cover the whole range of packaging printing demands, the models of the F&K 20SIX platform provide technologies all with the aim of improving productivity in order to minimize waste, change-over time and energy consumption.

In the field of vacuum metallizing, the focus will be on two key innovations - BOBST General Hawkeye Pinhole Detector and the AlOx process. The Hawkeye Pinhole Detector is a monitoring system which at full metallizer speed, detects defects which results in increased production speed and increases in the quality of the final product. The AlOx process produces clear film with good water and oxygen barrier levels and can be used for products including baked goods and microwaveable food where product visibility is required.

BOBST's gravure presses cover the widest spectrum of applications, such as the Rotomec platform solutions for flexible packaging and the LEMANIC lines for carton tobacco packaging. At Propak the focus will be on the brand new BOBST RS 5002 gravure printing press. A compact machine delivering great performance, this shaftless gravure press can add to Asian converters' productions the extra value that only a market-customized solution can provide.

Information and displays will also available to illustrate the effectiveness and performance of the range of BOBST multi-technology and solventless laminators, as well as the extrusion coating and laminating lines for flexible packaging and paper and board applications. In coating, the updates will be on BOBST latest developments in technologies for the market segments of labelstock, release liners, adhesive tapes, siliconizing, aluminium lacquering and printed electronics



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